Services | Nanoelectronics Research Center
top of page

Services & Facilities

Very high vacuum thermal evaporation unit
IMG_4186.tiff

Our in-house built unit is used for thermal evaporation & vapor deposition of various metals such as Cr, Ti, Au, Ag, Al onto desired substrate. It is frequently used to fabricate metallic leads on test samples in order to proceed conductivity and Hall measurements. It is also commonly used to coat insulating samples with metallic thin film, which leads to much better imaging under scanning electron microscope. The vacuum unit is capable to reach extremely high vacuum, i.e., up to 10e-8 Torr.

Scanning Probe Microscopy

DSCN2145_edited_edited.jpg

Our scanning probe microscope offers sub-nanometer scale sensitivity in the following modes:

Atomic Force Microscopy

Magnetic Force Microscopy

Electric Force Microscopy

Kelvin Probe Microscopy

Energy Dispersive X-Ray Spectroscopy

Screenshot 2023-04-30 at 02.00.46.png

We use EDS unit from Oxford-Instruments to characterize the samples and provide detailed report of the elements detected, together with SEM images including elemental spatial distribution of the sample.

Hydro-Oxy Generator & vacuum sealing unit

Screenshot 2023-04-30 at 02.30.18.png

2500 degree hydrogen flame allows us to seal quartz ampoules under vacuum around 10^-3 Torr, which is required to prepare samples for chemical vapor transport. The hydro-oxy generator can produce 200 L gas per hour and gas pressure varies between 0.1 - 0.2 Mpa. The system possesses 4.2 L electrolyte capacity.

Wire Bonder (wedge bonding)

DSCN2136_edited.jpg

Wire bonder uses ultrasonic power to bond Au or Al wires to samples placed on the heated table. Wire diameter can be chosen between 25 - 50μm. Ultrasonic power varies between 0-3W, 60kHz, two channel. Can be set separately of the two point. Bond time: 5 - 200ms, two channel Bond force:10 - 60g, two channel. Span between first bond to second bond by automatic mode:0- 10mm( motorized). Bond radian: 0-6mm(motorized).

8K LCD MSLA 3D Printing

Screenshot 2023-12-01 at 3.04.25 AM.png

High resolution resin printing system is able to create any 3D model with 29 micron sensitivity. We use this device to fabricate insulating vacuum parts, connectors, sockets, electronic devices and prototypes. 

Scanning Electron Microscopy (SEM)

DSCN2040.jpg

High-resolution Scanning Electron Microscope (SEM) with 150,000x magnification in 0-30kV electron acceleration range. Conventional secondary electron mode and backscattered electron mode can be used separately or combined. Material compounds and crystal structure differences can be observed by analyzing backscattered electrons. It delivers clear images without noise at high magnification and its panorama feature enables scanning a wider area.

Two zone horizontaltube furnace

tempImageM91kWa_edited.jpg

It is primarily used to grow semimetal and semiconductor based crystal structures, using methods such as chemical vapor transport (CVT) and chemical vapor deposition (CVD).

Scanning stage microscope

tempImage8FQF9y_edited.jpg

Computer controlled scanning stage microscope unit is used for i) optical imaging of samples ii) scanning laser microscopy iii) maskless laser lithography.

Plasma Cleaner /Etcher

IMG_4256.JPG

Our custom-built plasma cleaner system offers O2 plasma with adjustable energy to clean almost any surface. It can be applied in-stu right before the thermal evaporation, which increases the adhesion of the evaporated metal on the target surface. 

Direct Laser Lithography

IMG_E4280.JPG

Micro-meter-scale maskless lithography system is very useful tool in various applications. For example, it can effectively print any circuit scheme onto a photo-resist coated substrate using low power UV laser beam. Or, strong UV laser beam can be used to etch thin metallic layers on glass substrates. 

bottom of page